BriefingRoom on Connected Planet Online

TV reception using DVB-T and Full-SEG ISDB-T is now available on small battery powered devices

Paris, 10 September 2008: DiBcom, the leading provider of Mobile TV solutions, is pleased to announce two new products, the DIB9090 and DIB8090 which both support very low power mobile TV reception of DVB-T and ISDB-T 13SEG signals respectively. These chips also support the reception of DVB-H and ISDB-T 1SEG.

Historically, numerous countries have deployed DVB-T and ISDB-T Full-SEG for non mobile applications such as Home Digital TVs and Set Top Boxes/Digital Converters. Since June 2008, mobile phones using DiBcom chipsets have offered DVB-T reception in several European countries. In Japan, where 1SEG ISDB-T has been deployed on mobile phones, more than 30 Million units have already been sold and handset manufacturers are also starting to look at implementing reception of Full-SEG ISDB-T. This will enable them to offer high definition TV on large screen mobile phones.

However, DVB-T and Full-SEG ISDB-T currently use high level modulation schemes to transmit high bit-rate TV signals (Standard or High-Definition TV) making reception difficult in mobile conditions. The strong channel variations, the Doppler effect related to mobility and the adjacent channels are indeed much stronger when receiving high modulation signals compared to low bit-rate QVGA-size TV signals transmitted by DVB-H or ISDB-T 1SEG. DiBcom released the first Mobile TV DVB-T receivers for the automotive industry back in 2002. Yet it took another six years to reduce power consumption, size, and the number of discrete components to significantly low levels without compromising the high level performance that made DiBcom a leading Mobile TV reference.

The new generation of components like the DIB9090 and the DIB8090, has revolutionised the Mobile TV market by offering the highest performance at the lowest possible power consumption in all functional modes (for DVB-T and Full-SEG ISDB-T in particular). These new generation components draw on the successful features of their predecessors in addition to their small footprint. They therefore provide a very cost effective solution for DVB-T, DVB-H, Full-SEG and 1SEG ISDB-T Mobile TV reception on battery-powered devices. While others claim to provide low power solutions, their disappointing performance makes them unsuitable for DVB-T or Full-SEG ISDB-T reception. High linearity tuners as well as advanced signal processing algorithms implemented on smaller silicon geometries are vital for this performance vs. power trade-off.

“We are very pleased to see handsets implementing both DVB-T and DVB-H on the same platforms”, says Yannick Levy, CEO of DiBcom. “DVB-T based Free-To-Air TV signals are broadcast in many countries today, thus making it very attractive for consumers to try out TV reception on handhelds. Once users are hooked, they will demand more content and better coverage. In this way, they are more likely to subscribe to DVB-H services and watch more content on 3G. Handset manufacturers now see a real opportunity to create higher volumes compared to the levels that DVB-H only devices can achieve. This new feature is therefore a very attractive one to differentiate their products.”

A demo of the new DiBcom chips and many commercial products using DiBcom solutions will be shown in the DiBcom booth (A41, Hall 3) at IBC from September 12th to 16th.

About DiBcom
DiBcom is at the heart of mobile TV. As a fabless semiconductor company that designs high-performance chipsets, DiBcom enables low-power mobile and portable TV reception everywhere and at speeds exceeding 200 km/h. The company’s solutions are used in automotive, PC/peripheral, mobile phones and other handheld devices. DiBcom has extensive experience solving real-world mobile digital terrestrial television (DTT) reception problems and has overcome the main technological barriers to high-quality service. The company has developed a number of patented algorithms and architectures for fast and accurate channel estimation and high Doppler compensation. Its chipsets are compliant with the current worldwide Digital Video Broadcast standards DVB-T, DVB-H, DVB-SH, T-DMB and ISDB-T.

For more information, please visit www.dibcom.com

Press Contact:
Tanya Otis
PR Consultant
Open2America
T. 1.403.452.6506
t.otis@open2america.com

Paris: DiBcom, the leading provider of Mobile TV solutions, is pleased to announce that the Italian company MTC Multiconn s.r.l. will be the first to implement DiBcom’s “diversity-4” technology in their in-car digital TV receiver.

Receiving digital TV in a car travelling at high speeds requires advanced technology to ensure reliable and constant picture quality. In order to achieve the best results in the most demanding environments, DiBcom has introduced the MRC (Maximum Ratio Combining) diversity technology, which is a smart way to combine the digital TV signals received via 2 (or more) different antennas.

Multiconn is the first company to launch a ready-to-install in-car receiver using DiBcom’s “diversity-4” MRC technology. Individual antennas attached to four opposite car windows are connected to DiBcom’s DIB7070-M chips that integrate a VHF-UHF tuner along with a DVB-T/H demodulator.

The high integration of DiBcom’s chips has allowed Multiconn to create a very compact device, which can be easily dissimulated within the vehicle. In addition, the Multiconn in-car receiver features an automatic background scan thanks to 2 additional DIB7070-M chips. The Diversity Auto Scan (DAS) technology, developed by Multiconn, automatically locates and maintains the strongest TV signal found in the area, therefore delivering the best possible reception. The software application on the device also makes the system extremely user friendly: instead of having to manually scan for new programmes when out of the transmitter coverage area, the list of TV programmes available is automatically updated in real time throughout the journey.

“In countries such as Spain, Italy, France and Sweden, the use of DVB-T modulation modes in 64QAM impair reception in the mobile environment. Implementations and field tests have shown that using “diversity-4” (4 antennas) in these countries drastically increases the reliability of digital TV reception, enabling comfortable in-car use,” said Pascal Prost, Director of Product Marketing at DiBcom. “We are extremely pleased that a leading company like Multiconn is integrating DiBcom’s technology to provide innovative solutions and enhance Mobile TV accessibility throughout Europe.”

“The launch of this new auto-scanning and DAS system will enable us to raise the standard of in-car digital TV and we are very proud to be working alongside an industry pioneer and leader such as DiBcom on this exciting project,” said Luca Bacilieri, Multiconn’s CEO.

A demo of the Multiconn DAS system will be shown in the DiBcom booth A41, Hall3 at IBC from Sept. 12th to Sept. 16th.

About DiBcom
DiBcom is at the heart of mobile TV. As a fabless semiconductor company that designs high-performance chipsets, DiBcom enables low-power mobile and portable TV reception everywhere and at speeds exceeding 200 km/h. The company’s solutions are used in automotive, PC/peripheral, mobile phones and other handheld devices. DiBcom has extensive experience solving real-world mobile digital terrestrial television (DTT) reception problems and has overcome the main technological barriers to high-quality service. The company has developed a number of patented algorithms and architectures for fast and accurate channel estimation and high Doppler compensation. Its chipsets are compliant with the current worldwide Digital Video Broadcast standards DVB-T, DVB-H, DVB-SH, T-DMB and ISDB-T.

For more information, please visit HYPERLINK “http://www.dibcom.com” www.dibcom.com

About Multiconn
Multiconn is a leading company in the production and trade of connectors and components for harnesses. By being aware of the needs of national and international markets, the company has become specialised in the study, the development, the production and trade of electrical connection devices and the manufacture of high quality leads. In this way, they are able to offer multiple solutions for different fields of application like the automotive, audiovisual and electronics industries. Their international links with associates in both Europe and the Far-East allow them to operate in the market in a systematic way, satisfying even the most specific demands. Their Taiwan office is ISO9001 certified and has its own R&D department which works in tandem with its European counterpart. It offers a range of design and manufacturing capabilities, including product design, material sourcing and post production material support.

For more information, please visit www.multiconn.it

Press Contact:
Tanya Otis
Open2America
t.otis@open2america.com
1.403.452.6506

Wavesat Announces Distribution Agreement with DigiPro to Deliver 4G Solutions in China and Taiwan

Leader in Broadband Wireless Solutions Expands Presence to Meet Market Demand for Odyssey 8500™ Multimode Chipset

Telecom Asia, Bangkok, September 3, 2008 – Wavesat, a leading supplier of Broadband Wireless semiconductor solutions, today announced a distribution agreement with DigiPro Technology Ltd. to meet the growing demand for Wavesat’s Odyssey 8500™ chipset and reference designs in China and Taiwan. DigiPro will expand the Company’s presence in the region while complementing existing channel relationships.

Wavesat has seen impressive gains in the Asian region over the past year, including recent agreements with the Japanese operator Willcom and Taiwanese ODM Compal. DigiPro will help Wavesat build on this momentum.

“DigiPro has excellent penetration with ‘Tier One’ manufacturers in wireless networking markets, including WiMAX and WiFi, as well as major PC and portable consumer electronics suppliers. They also have both the business reach and the technical bench strength to help increase our market presence in this major wireless ecosystem region,” said Raj Singh, President and CEO, Wavesat. “This partnership will strengthen our presence and augment our channel opportunities, with increased local support for existing and future customers.”

“We believe Wavesat’s multimode Odyssey 8500 chip is a superior broadband technology and will allow regional OEMs, ODMs, carriers and end customers to realize the promise of 4G communications,” said Jason Wu, President, DigiPro. “Our strong engineering focus and local support combined with Wavesat’s Odyssey portfolio offers the right solution of performance, power and cost to consumer device manufactures throughout the region.”

About the Odyssey 8500™ Chipset
The Odyssey 8500 chipset from Wavesat is powered by a unique 4G multi-core architecture incorporating multiple ultra low power DSPs, offering flexibility, high performance and low power consumption, without any tradeoff. The SOC manufactured using advanced Embedded DRAM technology requires no external memory, thus saving customers valuable real estate, cost and power consumption for very small form-factor portable and mobile applications such as wireless USB dongle, mobile handsets and other consumer electronic devices.

About DigiPro
DigiPro is a professional semiconductor and electronic component distribution company in the Asia Pacific region, specialized in design-in oriented products. Our sales network covers Taiwan, Hong Kong and China in various application areas including PC, Wireless, Consumer, Communications and Multimedia. For more information, please visit www.digipro-tech.com

About Wavesat
Wavesat is a global leader in mobile broadband, providing advanced semiconductor solutions to the world’s leading carrier and mobile device manufacturers to deploy future-proof broadband services and products. With award winning technology, Wavesat delivers silicon that enables customers to deploy multiple Broadband Wireless technologies such as WiMAX Wave2, WiFi, and XG-PHS today and to migrate seamlessly to future 4G technologies such as LTE. Wavesat is a principal member of the WiMAX Forum®. For more information, please visit www.wavesat.com.

For more info:

Wavesat
Veronica Farmer
Marketing Communications
T +1 514.684.0200, ext. 388
M +1 613.862.3346
vfarmer@wavesat.com

Mike Newsom
LouVan Communications
T +1 508.541.9036
M +1 617.803.5385
louvanpr@comcast.net
AIM: louvanpr

NeoPhotonics Is Top Optical Component Supplier To Huawei
For The First Half Of 2008

40 Percent YOY Sales Growth Establishes NeoPhotonics as a Top Supplier to the World’s Fastest Growing Manufacturer of Telecommunications Network Gear

Shenzhen – September 2, 2008 – NeoPhotonics today announced in conjunction with the China International Optoelectronic Exposition (CIOE) that sales figures from 2006 through 2Q 2008 have established the company as a top supplier of optical components — for fiber access, metro and long-haul optical network equipment — to Huawei, one of the world’s largest suppliers of telecommunications network equipment (Huawei reported contract sales of US $16 billion in 2007).

NeoPhotonics provides a broad spectrum of active and passive optical components, modules and subsystems, including SONET/SDH, GPON and GEPON transceivers, Planar Lightwave Circuit (PLC) DWDM Multiplexer/Demultiplexers, VOA Multiplexers and Reconfigurable Optical Add Drop Multiplexers (ROADM), and Micro-Electro-Mechanical (MEMS) VOAs and Modules. Huawei uses NeoPhotonics products in their OptiX metro and long haul systems and in their FTTx-ODN access solutions.

“While Huawei does not officially report purchasing figures from their suppliers, we have been informed that Huawei purchased more optical components from NeoPhotonics than any other supplier in the first half of 2008,” stated Tim Jenks, CEO of NeoPhotonics. “We are very pleased to achieve this level of recognition at Huawei given Huawei’s extremely rapid growth and world wide success. We feel that NeoPhotonics has become a trusted supplier to Huawei due to our high volume manufacturing and shipping operations in Shenzhen, our high quality and our advanced technology.”

“NeoPhotonics has located the bulk of its manufacturing infrastructure and a significant portion of its development engineering resources here in Shenzhen, and we have made serving Shenzhen based telecom system companies like Huawei a strong priority,” stated Ping Xie, General Manager of NeoPhotonics China. “We have watched Huawei’s spectacular growth on the international stage with admiration, and we are determined to continue to meet Huawei’s needs for advanced higher performance optical components.”

NeoPhotonics is showcasing here at CIOE, in booth A811, the industry’s most complete portfolio of MEMS and PLC based optical solutions, as well as NeoPhotonics® extensive portfolio of GPON and GEPON transceivers for FTTH applications and its broad line of telecom transceiver products in SFF, SFP and XFP form factors.

About NeoPhotonics

NeoPhotonics Corporation is a leading developer and vertically integrated manufacturer of photonic integrated circuit (PIC) based components, modules and subsystems for use in telecommunications networks. Our products include active semiconductor, passive PLC and MEMS multi-dimensional switching functions in a single product. This integration is enabled by integration, nanomaterials and nanoscale design and fabrication technologies. Backed by leading venture capital firms and institutional investors, NeoPhotonics maintains headquarters in San Jose, California and ISO 9001:2000 certified engineering and manufacturing facilities in Silicon Valley and Shenzhen, China.

NeoPhotonics is a registered trademark and the red dot logo is a trademark of NeoPhotonics Corporation. All other marks are the property of their respective owners.

www.neophotonics.com

CONTACT

Mike Newsom
LouVan Communications Inc.
voice: +1 508.541.9036 / mobile +1 617.803.5385
email: louvanpr@comcast.net
AIM: louvanpr